For excellent papers after expandation will be recommended to SCI/Ei indexing Journal. 

Special Issue "Building Three-Dimensional Integrated Circuits and Microsystems"
Processes (ISSN 2227-9717), IF of Journal 2.847; one OA Journal from MDPI
Scopes
Micro/nano fabrication technology related to 3D integration;
Design Automation, process/device/packaging simulation, and thermal-mechanical reliability of 3D integration;
Novel materials, components, circuits and technology to be used in 3D integration, e.g., triboelectronic nanogenerator, artificial intelligence, etc.

Special Issue "Toward Performance Optimization of Wireless Sensor Networks and Sensor Node Devices in Environmental Monitoring"
Sensors (ISSN 1424-8220). IF of Journal 3.576; One OA Journal form MDPI
Scopes
Energy (self-powered sensors, stability, environmental protection);
Communication (security, scalability); data processing (distributed, big data, robustness);
Artificial intelligence in WSNs; Industrial WSNs; Body sensor networks; Novel sensor device for WSNs.